The Effect of antimony presence in anodic copper on kinetics and mechanism of anodic dissulation and cathodic deposition of copper
J. Min. Metall. Sect. B-Metall. 44 (1) B (2008) 107-114. DOI:10.2298/JMMB0801107S
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Abstract
The Effect of antimony presence in anodic copper on kinetics and mechanism of anodic dissulation and cathodic deposition of copper
J. Min. Metall. Sect. B-Metall. 44 (1) B (2008) 107-114. DOI:10.2298/JMMB0801107S
Full text (pdf)
Abstract